Vacuum packaging and semipassive chips for wireless temperature monitoring in industrial applications

  1. Tijero, M.
  2. Eguiluz, X.
  3. Elizalde, J.
  4. Diez, V.
  5. Arriola, A.
  6. Aranburu, I.
  7. Zarketa, A.
  8. Martinez-Agirre, M.
  9. Martin-Mayor, A.
  10. Bou-Ali, M.M.
Aktak:
Proceedings of IEEE Sensors

ISSN: 2168-9229,  1930-0395

ISBN: 9781509010127

Argitalpen urtea: 2017

Alea: 2017-December

Orrialdeak: 1-3

Mota: Biltzar ekarpena

DOI: 10.1109/ICSENS.2017.8234235 GOOGLE SCHOLAR lock_openeBiltegia editor
Datuen iturria: Scopus